Logo   | Search
About
Project Feasibility Study
Hardware Design &
Fabrication
Program Development & Debugging
Product Characterization & Correlation


 
   
 
 
Enter
 
 
Motorola, TI in tech sharing tie-up
 

BANGALORE: Mobile phone users looking at advanced technology handsets will soon benefit from a technology tie-up between two technology majors. New handsets using their technologies are expected to be available to users by 2008.

Motorola Inc, a leader in mobile communications and seamless mobility solutions and Texas Instruments (TI), specialising in silicon solutions for wireless communications on Tuesday announced a strategic technology sharing relationship. Their Indian arms also stand to benefit.

The tech sharing will include 3G, WiMAX (worldwide interoperability for microwave access) and OMAP (operations, maintenance and administration processor), in the design and development of experience optimised mobile devices. The arrangement is to cover current, emerging and next generation wireless standards and will leverage intellectual property from both companies.

As a follow-up, Motorola is developing 3G handsets based on a TI customised solution that will include high-performance, power-efficient processors from TI's OMPAP 3 architecture and advanced 3G and 3.5G building blocks from both.

TI is supporting Motorola's mobile WiMAX initiative, including development of a customised WiMAX solution and providing digital design elements, high performance analog components, RF solutions and manufacturing process and fabrication expertise. The solution will focus on core 802.16e mobile WiMAX functionality supporting, voice, video and data for low-power mobile applications. The solution is expected to be ready for production of new mobile devices that Motorola plans to launch during 2008.

 

 



Chip Test
 
Copyright © 2012 ChipTest, All Rights Reserved | Disclaimer
Designed & Developed by Cherry
Home