OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced the smallest SMD ESD protection TVS diode available in the industry. The approximate size of the device is 0.020 x 0.010 (0.6mm x 0.3mm or 600um x 300um) and it is built using advanced silicon technology. The product is a surface-mountable Flip Chip with two solder bumps for direct attachment to Printed Circuit Boards. The ESD0201 has superior electrical performance and exceeds the requirements of IEC61000-4-2 level 4. This product offers ESD level in excess of 30kV contact discharge when tested to IEC61000 standards. In spite of the exceptionally high ESD level, this device offers a relatively low input capacitance of under 20 pF.

Mobile computing and consumer products are becoming increasingly susceptible to ESD failures and therefore all tier1 manufacturers are switching to silicon based diode protection. Since they predominantly use integrated circuits (IC) with sub-micron geometries and low working voltages, the traditional high clamp voltage polymers and varistors have become inadequate. ESD0201 offers clamp voltage as low as 10V which virtually eliminates IC latch-up and soft errors.

"At OnChip we are rapidly expanding our product portfolio. This is our fourth major product launch in less than 3 months," said Ashok Chalaka, President and CEO. "The introduction of the ESD0201 diodes is a significant milestone for OnChip and it clearly establishes us as a market leader. This product offers the smallest form-factor and the highest ESD protection level in the industry. The ultra miniature size, the very high ESD level, the relatively small junction capacitance and low clamp voltage make this part very attractive to system designers."