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Hardware Design &
Fabrication
Program Development & Debugging
Product Characterization & Correlation


 
   
 
 
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Make
Model #
Resources
1 Ambient MCT 3608A 150 Mil 8/14/16 SO, 16/20/24/28 QSOP, 40/48/80 QVSOP
MH 240 150 Mil 8/14/16 SO, 16/20/24/28 QSOP
MH 240 173 Mil 20/24 TSSOP
TESEC 9718-HT SOT 23 – 3 ld, SOT 143 – 4 ld, Bowl Feed, Integrated T&R
TESEC 3270IH- MAP TDFN & UDFN Packages- 1.7x1.35; 3.3x1.35; 1x1.25; 2.5x1.2; 6x4; 2.5x1.35; 1x1.45; 2.5x1
SRM XD 248 TDFN & UDFN Packages - 1.6x1.3; 1.7x1.35; 2x2; 2.5x2.5; 3x1.35; 3x1.35; 3x3; 3.3x1.35; 4x1.6; 3.3x1.35; 1.7x1.35; 3x1
2 HOT  MCT 3608E 150 Mil 8/14/16 SO, 16/20/24/28 QSOP, 40/48/80 QVSOP
MCT 3608E 240 Mil 48/56/64 TSSOP
MCT 3608E 300 mil 8/14/16/18/20 PDIP, 600 mil 24/28/40 PDIP
MH 245 150 Mil 8/14/16 SO, 16/20/24/28 QSOP, 40 QVSOP
MH 245 300 Mil 16/20/24 SOIC
SYNAX SX 1211 TQFN Packages- 7x7, 5x6
MCT 5105 173 Mil 8/16 TSSOP, 150 Mil 8 SO, 20 QSOP, TQFN, TDFN
MT 8704iHF 150 Mil 8/14/16 SO, 16/20/24/28 QSOP, 173 Mil 16 TSSOP, 240 Mil 48/56/64 TSSOP,  300 Mil 20 SOIC/48/56 SSOP
MT MT TQFN Packages - 5x11; 3x3; 3.5x9


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